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Formation of intermetallics and grain boundary diffusion in Cu-Al and Au-Al thin film couples
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Publications
Formation of intermetallics and grain boundary diffusion in Cu-Al and Au-Al thin film couples
Formation of intermetallics and grain boundary diffusion in Cu-Al and Au-Al thin film couples
JV
J.M. Vandenberg
J.M. Vandenberg
FB
F.J.A. Den Broeder
F.J.A. Den Broeder
RH
R.A. Hamm
R.A. Hamm
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1 July 1982
journal article
Published by
Elsevier
in
Thin Solid Films
Vol. 93
(3)
,
277-280
https://doi.org/10.1016/0040-6090(82)90133-x
Abstract
No abstract available
Keywords
INTERMETALLICS
THIN FILM
AL AND AU
GRAIN BOUNDARY DIFFUSION
CU AL
FILM COUPLES
Cited by 17 articles