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Thermal Deformations in Electronic Packaging
Home
Publications
Thermal Deformations in Electronic Packaging
Thermal Deformations in Electronic Packaging
DP
Daniel Post
Daniel Post
BH
Bongtae Han
Bongtae Han
PI
Peter Ifju
Peter Ifju
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1 January 1994
book chapter
Published by
Springer Nature
p.
331-347
https://doi.org/10.1007/978-1-4612-4334-2_10
Abstract
No abstract available
Keywords
THERMAL
EXPERIMENTAL
INTERFEROMETRY
DOCUMENTATION
STRUCTURES
INTERCONNECTIONS
PACKAGE
MADE
SMALLER
COMPRISING
Cited by 4 articles