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High Frequency Characterization Of Tape-Automated Bonding (TAB) Interconnects
Home
Publications
High Frequency Characterization Of Tape-Automated Bonding (TAB) Interconnects
High Frequency Characterization Of Tape-Automated Bonding (TAB) Interconnects
SW
S. M. Wentworth
S. M. Wentworth
DN
D. P. Neikirk
D. P. Neikirk
CB
C. R. Brahce
C. R. Brahce
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8 September 1988
proceedings article
Published by
SPIE-Intl Soc Optical Eng
Vol. 0947
,
81
https://doi.org/10.1117/12.947451
Abstract
No abstract available
Keywords
PACKAGING
GOLD
COPPER
Cited by 1 article