Stress relaxation and hillock growth in thin films
- 30 November 1982
- journal article
- Published by Elsevier in Acta Metallurgica
- Vol. 30 (11), 1993-2000
- https://doi.org/10.1016/0001-6160(82)90103-1
Abstract
No abstract availableThis publication has 12 references indexed in Scilit:
- Thermal strain in lead thin films IV: Effects of multiple cycling to 4.2 KThin Solid Films, 1979
- Thermal strain in thin lead films III: Dependences of the strain on film thickness and on grain sizeThin Solid Films, 1979
- Thermal strain in lead thin films II: strain relaxation mechanismsThin Solid Films, 1978
- Residual strains of Pb thin films deposited onto Si substratesActa Metallurgica, 1978
- Thermal strain in lead thin films I: Dependence of the strain on crystal orientationThin Solid Films, 1977
- Constitutive Relations for the Nonelastic Deformation of MetalsJournal of Engineering Materials and Technology, 1976
- Mechanical equation of state and grain boundary sliding in lead in monotonic loadingActa Metallurgica, 1974
- Strain-relaxation in thin films on substratesActa Metallurgica, 1974
- Diffusion creep of a thin foilPhilosophical Magazine, 1966
- Low-Temperature Properties of Evaporated Lead FilmsJournal of Applied Physics, 1963