Study of interdiffusion of Ni/Fe layers by Auger Sputter profiling
- 1 March 1979
- journal article
- Published by Elsevier in Surface Science
- Vol. 81 (2), 355-369
- https://doi.org/10.1016/0039-6028(79)90105-5
Abstract
No abstract availableKeywords
This publication has 28 references indexed in Scilit:
- Sputtering in the surface analysis of solids: A discussion of some problemsJournal of Vacuum Science and Technology, 1976
- Diffusion mechanisms in the Pd/Au thin film system and the correlation of resistivity changes with Auger electron spectroscopy and Rutherford backscattering profilesThin Solid Films, 1976
- A formalism for extracting diffusion coefficients from concentration profilesSurface Science, 1976
- Thin-film interdiffusion. II. Ti-Rh, Ti-Pt, Ti-Rh-Au, and Ti-Au-RhJournal of Applied Physics, 1975
- Thin-film interdiffusion. I. Au-Pd, Pd-Au, Ti-Pd, Ti-Au, Ti-Pd-Au, and Ti-Au-PdJournal of Applied Physics, 1975
- Analysis of grain boundary diffusion in bimetallic thin film structures using Auger electron spectroscopyJournal of Vacuum Science and Technology, 1975
- Techniques for elemental composition profiling in thin filmsC R C Critical Reviews in Solid State Sciences, 1973
- Quantitative auger analysis of copper-nickel alloy surfaces after argon ion bombardmentSurface Science, 1973
- Use of Auger Electron Spectroscopy and Inert Gas Sputtering for Obtaining Chemical ProfilesJournal of Vacuum Science and Technology, 1972
- Alloy Sputtering Studies with in situ Auger Electron SpectroscopyJournal of Applied Physics, 1971