Localization of Electrical Shorts in Dies and Packages using Magnetic Microscopy and Lock-in-IR Thermography

1 July 2006

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

p. 252-255
https://doi.org/10.1109/ipfa.2006.251041

Abstract

Scanning SQUID microscopy (SSM) is used to visualize current paths on package and die level. In case studies it is shown, how the integration of SSM into the failure analysis flow and its combination with lock-in-IR thermography (LIT) makes it faster and allows more reliable interpretation of results

Keywords

MICROMAGNETICS
SQUIDS
VISUALIZATION
FAILURE ANALYSIS
METALLIZATION
MICROSCOPY
SEMICONDUCTOR DEVICE PACKAGING
SEMICONDUCTOR DEVICES
STIMULATED EMISSION
SIGNAL PROCESSING

This publication has 3 references indexed in Scilit:

HTS scanning SQUID microscopy of active circuits
IEEE Transactions on Applied Superconductivity, 1999
HTS scanning SQUID microscope cooled by a closed-cycle refrigerator
IEEE Transactions on Applied Superconductivity, 1999
Design and applications of a scanning SQUID microscope
IBM Journal of Research and Development, 1995

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