Localization of Electrical Shorts in Dies and Packages using Magnetic Microscopy and Lock-in-IR Thermography
- 1 July 2006
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 252-255
- https://doi.org/10.1109/ipfa.2006.251041
Abstract
Scanning SQUID microscopy (SSM) is used to visualize current paths on package and die level. In case studies it is shown, how the integration of SSM into the failure analysis flow and its combination with lock-in-IR thermography (LIT) makes it faster and allows more reliable interpretation of resultsKeywords
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