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GE high density interconnect: a solution to the system interconnect problem
Home
Publications
GE high density interconnect: a solution to the system interconnect problem
GE high density interconnect: a solution to the system interconnect problem
MA
M. Adler
M. Adler
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2 January 2003
conference paper
Published by
Institute of Electrical and Electronics Engineers (IEEE)
https://doi.org/10.1109/ntc.1992.267906
Abstract
No abstract available
Keywords
DISPLAYS
PACKAGING
LITHOGRAPHY
RAPID THERMAL PROCESSING
Cited by 4 articles