Voiding due to thermal stress in narrow conductor lines
- 31 August 1989
- journal article
- Published by Elsevier in Scripta Metallurgica
- Vol. 23 (8), 1323-1328
- https://doi.org/10.1016/0036-9748(89)90053-7
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- Overview no. 2: Non-equilibrium models for diffusive cavitation of grain interfacesActa Metallurgica, 1979
- Diffusional Viscosity of a Polycrystalline SolidJournal of Applied Physics, 1950