Role of the Interfacial Thermal Barrier in the Effective Thermal Diffusivity/Conductivity of SiC‐Fiber‐Reinforced Reaction‐Bonded Silicon Nitride
- 1 February 1990
- journal article
- Published by Wiley in Journal of the American Ceramic Society
- Vol. 73 (2), 312-316
- https://doi.org/10.1111/j.1151-2916.1990.tb06511.x
Abstract
No abstract availableKeywords
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