A damage integral approach to thermal fatigue of solder joints
- 1 January 1989
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 12 (4), 480-491
- https://doi.org/10.1109/33.49005
Abstract
No abstract availableThis publication has 10 references indexed in Scilit:
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