Integrated ferroelectric microelectromechanical systems (MEMS)

Abstract

A ferroelectric test chip has been fabricated consisting of 1) piezoelectric (PZT) microsensors (accelerometers), 2) low-voltage, 3-μm, n-well CMOS signal conditioning electronics, 3) high-voltage (HVMOS) drive electronics, and 4) PZT microactuator diaphragms and cantilevers. This test chip has been developed to address processing problems encountered in the fabrication of integrated ferroelectric microelectromechanical systems (FMEMS). A description fabrication, IC-compatible process integration, electrical performance of diagnostic MEMS circuits and devices is presented.