IBM Multichip Multilayer Ceramic Modules for LSI Chips-Design for Performance and Density
- 1 March 1980
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 3 (1), 89-93
- https://doi.org/10.1109/tchmt.1980.1135570