Plasma Etching of CVD Grown Cubic SiC Single Crystals

Abstract
Plasma etching of CVD grown cubic SiC single crystals with CF4+O2 mixture gas was investigated for the first time. The O2 gas composition, rf power and pressure dependence of the etching rate were clarified. The maximum etching rate was obtained with the O2 gas composition of 67%. The ratio of the etching rate between cubic SiC and Cr was found to be about 8.3, which indicates Cr as a good etching mask for cubic SiC.

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