Properties of copper–aluminum oxide films prepared by solution methods
- 1 May 2002
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 411 (1), 129-133
- https://doi.org/10.1016/s0040-6090(02)00201-8
Abstract
No abstract availableThis publication has 11 references indexed in Scilit:
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