A comparison of copper and gold wire bonding on integrated circuit devices
- 1 January 1990
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 13 (4), 673-681
- https://doi.org/10.1109/33.62578
Abstract
No abstract availableThis publication has 5 references indexed in Scilit:
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- Investigation of the Reliability of Copper Ball Bonds to Aluminum ElectrodesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987
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- Gold-Aluminum Intermetallics: Ball Bond Shear Testing and Thin Film Reaction CouplesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1984
- Gold-aluminum thin-film interactions and compound formationJournal of Applied Physics, 1981