An Empirical Crack Propagation Model and its Applications for Solder Joints
- 1 June 1996
- journal article
- Published by ASME International in Journal of Electronic Packaging
- Vol. 118 (2), 104-107
- https://doi.org/10.1115/1.2792128
Abstract
This paper investigates a strain based crack propagation model, and discusses the application of fracture mechanics approach in the reliability validation of leadless solder joints. The model includes the creep effect at different temperatures and hold times, and correlates well the thermal cycling test of 90 Pb/10 Sn joints. By apply this model, an engineering method to develop the inspection criteria in accelerated reliability validation tests of leadless solder joints is proposed.Keywords
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