The Structural Stability of Tin-Nickel Electrodeposits
- 1 January 1960
- journal article
- research article
- Published by Taylor & Francis in Transactions of the IMF
- Vol. 37 (1), 108-109
- https://doi.org/10.1080/00202967.1960.11869806
Abstract
Metallographie and X-ray examination of tin-nickel electrodeposits has shown that, in the as-plated condition, they are single-phase with a nickel arsenide type of crystal structure. These deposits are structurally stable at temperatures up to at least 500°C but at 700°C and above decomposition into a mixture of two phases, Ni3Sn2 and Ni3Sn4, takes place.Keywords
This publication has 2 references indexed in Scilit:
- The Solderability of Some Tin, Tin Alloy and Other Metallic CoatingsTransactions of the IMF, 1959
- Constitution of Binary AlloysJournal of the Electrochemical Society, 1958