The electrodeposition of gold by pulse plating
- 1 June 1977
- journal article
- Published by Springer Nature in Gold Bulletin
- Vol. 10 (2), 38-44
- https://doi.org/10.1007/bf03215426
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
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- Pulse plating of nickel-gold alloysSurface Technology, 1976
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- Gold alloys for precision resistancesGold Bulletin, 1972
- Pulse Electroplating of High-Resistance Materials, Poorly Contacted Devices, and Extremely Small AreasJournal of the Electrochemical Society, 1971
- Electrodeposition of Gold by Pulsed CurrentJournal of the Electrochemical Society, 1971
- Gold-Alloy Electrodeposits—Phase and Microstructural Changes Induced by Heat Treatment as Revealed by X-RaysJournal of the Electrochemical Society, 1970
- Cyclic Electrolysis: Part II—The Influence of Periodic Reversal of Current Upon the Surface Roughness of Electrodeposited CopperTransactions of the IMF, 1956