Die Attach in Hi-Rel P-Dips: Polyimides or low chloride Epoxies?
- 1 December 1984
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 7 (4), 394-398
- https://doi.org/10.1109/tchmt.1984.1136379
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- The Quality of Die-Attachment and Its Relationship to Stresses and Vertical Die-CrackingIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983
- A Contribution of Polymer Die Attach Systems to the Reliability of Plastic Encapsulated Integrated Circuits8th Reliability Physics Symposium, 1982
- Thermal Stress in Bonded JointsIBM Journal of Research and Development, 1979