Abstract
Fabrication of Schottky‐barrier solar cells by electroless nickelplating can be recognized as a practical approach because cells made by this method are of lower cost, have good adhesion to the surface, higher barrier potential height, and lower reflectivity of light as compared with those of the vacuum‐evaporated devices. No expensive equipment, such as a vacuum evaporator or high‐temperature diffusion oven, is needed for this manufacture.