A method for forming a printed circuit was carried out. The method comprises coating the surface of an insulating substrate with a solution of silver salts of organic acids in a mixed solvent consisting of alcohol, water, and ammonia to form a photosensitive layer thereon, exposing the layer to uv‐light so as to deposit the metal silver on a pattern of a desired circuit, and carrying out the electroless plating on the pattern, whereby the deposited metal silver functions as the nuclei for the plating.