Direct formation of ferrite films in wet process

Abstract

We have prepared a polycrystalline Co-ferrite film by the electroless ferrite-plating technique of our invention [J. Appl. Phys. 55, 2614 (1984)] in an aqueous solution at 70 °C on substrates of organic compounds (polyethylene terephthalate, polymethyl methacrylate, polycarbonate, Teflon), a stainless steel, and a polyester fiber. We used no intermediate layer, which we needed previously to enhance the adhesion of the ferrite film to the surface. By exposing the organic substrates to an rf-excited air plasma, the wettability of the surface improved, which enhanced the adhesion of the film to the substrate. Here we have measured the adhesion by a cross-cut test. The plasma forms hydrophilic groups such as -OH and -COOH, which improve the wettability. The OH group adsorbs the metal ions in the reaction solution, initiating the ferrite film formation. The glass shows a strong adhesion to the film even when it is not exposed to the plasma, because the glass has the OH group on the surface inherently. The stainless steel does not enhance the adhesion by the plasma treatment because the plasma forms no OH group on the metal surface. The adhesion power higher than ∼10 kg/cm2 has been obtained between the Co-ferrite film and the glass (not plasma treated), the polyethylene terephthalate (plasma treated) and the Teflon (plasma treated).