Effects of Film Texture on Electromigration Lifetime Predictions
- 24 October 1992
- journal article
- Published by Springer Nature in MRS Proceedings
- Vol. 265 (1), 113-118
- https://doi.org/10.1557/proc-265-113
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
- Correlation of texture with electromigration behavior in Al metallizationApplied Physics Letters, 1991
- Characterization of the early stages of electromigration at grain boundary triple junctionsApplied Physics Letters, 1991
- Texture Development in Thin Metallic FilmsTexture, Stress, and Microstructure, 1991
- Grain size dependence of electromigration-induced failures in narrow interconnectsApplied Physics Letters, 1989
- A high ionization efficiency source for partially ionized beam depositionJournal of Vacuum Science & Technology A, 1988
- Effect of texture and grain structure on electromigration in Al-0.5%Cu thin filmsThin Solid Films, 1981
- Electromigration Damage in Aluminum Film ConductorsJournal of Applied Physics, 1970
- The effect of relative crystal and boundary orientations on grain boundary diffusion ratesActa Metallurgica, 1954