Liquid cooling of microelectronic devices by free and forced convection
- 1 April 1972
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 11 (2), 213-222
- https://doi.org/10.1016/0026-2714(72)90704-4
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- Packaging and cooling problems associated with microelectronics equipmentMicroelectronics Reliability, 1969
- Series solution for heat transfer through a turbulent boundary layerInternational Journal of Heat and Mass Transfer, 1966