Fundamental Machining Characteristics of Ultrasonic Assisted Internal Grinding of SiC Ceramics
- 11 March 2014
- journal article
- research article
- Published by Taylor & Francis in Materials and Manufacturing Processes
- Vol. 29 (5), 557-563
- https://doi.org/10.1080/10426914.2014.892615
Abstract
Silicon carbide (SiC) ceramics has been utilized in a variety of engineering applications because of its desirable properties. Meanwhile, SiC ceramics is a typical hard-brittle material; hence it is difficult to machine. In this study, ultrasonic assisted internal grinding (UAIG) technique was proposed for the precision internal grinding of SiC ceramics, and its fundamental machining characteristics were investigated experimentally. Conventional internal grinding (CIG) test was also carried out on the same experimental rig but without ultrasonic vibration for comparison. The experimental results of UAIG compared with those of CIG show that (1) the normal force and tangential force in UAIG are considerably smaller than those in CIG by up to 30.7% and 56.25%, respectively; (2) the improvement of the form accuracy and the surface roughness become greater, i.e., in CIG, the roundness and cylindricity of workpiece are improved by 67.4% and 56%, respectively, after grinding, whereas in UAIG by 86% for both the roundness and cylindricity; the surface roughness R a in CIG is decreased by 76.5% after grinding, whereas in UAIG by 84.9%; (3) grinding cracks occurring on the work-surface are considerably restrained; (4) grain cutting edge protrusions are sufficiently observed; (5) subsurface damages are alleviated, i.e., the fracture depth is decreased by 17% and cracks are reduced.Keywords
This publication has 21 references indexed in Scilit:
- Experimental and numerical investigations of single abrasive-grain cuttingInternational Journal of Machine Tools and Manufacture, 2011
- Fabrication of Gradient Porous SiC Ceramics with Directional Pores without TemplatesMaterials and Manufacturing Processes, 2011
- Material removal of optical glass BK7 during single and double scratch testsWear, 2010
- A new two-dimensional ultrasonic assisted grinding (2D-UAG) method and its fundamental performance in monocrystal silicon machiningInternational Journal of Machine Tools and Manufacture, 2010
- Mechanism for material removal in diamond turning of reaction-bonded silicon carbideInternational Journal of Machine Tools and Manufacture, 2009
- Performance of Diamond and CBN Single-Layered Grinding Wheels in Grinding TitaniumMaterials and Manufacturing Processes, 2008
- Grain size dependence of scratch-induced damage in alumina ceramicsWear, 2008
- Grinding of Toroidal and Cylindrical Surfaces on SiC Using Diamond Grinding WheelsMaterials and Manufacturing Processes, 1997
- Study on Ultrasonic Internal Grinding by Using the Longitudinally Vibrated Grinding Wheel : 2nd Report, The Outline of the EffectsTransactions of the Japan Society of Mechanical Engineers, 1961
- Study on Ultrasonic Internal Grinding by Using the Longitudinally Vibrated Grinding Wheel : 1st Report, Traverse Ultrasonic CuttingTransactions of the Japan Society of Mechanical Engineers, 1961