Grain Boundary Sliding in High-Purity Aluminium Bicrystal and Al–Cu Solid Solution Bicrystal during Plastic Deformation
- 1 January 1969
- journal article
- Published by Japan Institute of Metals in Transactions of the Japan Institute of Metals
- Vol. 10 (3), 215-222
- https://doi.org/10.2320/matertrans1960.10.215
Abstract
No abstract availableThis publication has 5 references indexed in Scilit:
- Grain Boundary Sliding in High-Purity Aluminium Bicrystals during the Shear Test under Constant Load and TemperatureJournal of the Japan Institute of Metals and Materials, 1966
- Grain-Boundary Sliding in High-Purity Aluminium (99.999%) Bicrystals during the Shear Test under Constant Stress and Heating Rate ConditionsJournal of the Japan Institute of Metals and Materials, 1965
- Grain Boundary Slip and Migration of High Purity Aluminum Bicrystal Deformed in ShearingJournal of the Japan Institute of Metals and Materials, 1965
- Shear along grain boundaries in aluminum bicrystalsJOM, 1957
- Determination of the Crystal Orientation by Light FiguresJournal of the Japan Institute of Metals, 1941