Tensile strengths of bonds between evaporated silver coatings have been found to be related to the bias voltage on the substrate during deposition. Silver coatings between 12 and 50 μ thick were deposited by using a hollow cathode evaporator on 304 stainless steel substrates at bias voltages from 0 to −80 V. Tensile strengths up to 3.85×109 dyn cm−2 (56 ksi) have been achieved at relatively low bonding pressures and temperatures.