Elastic stiffness and thermal expansion coefficient of BN films
- 15 January 1980
- journal article
- research article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 36 (2), 161-163
- https://doi.org/10.1063/1.91415
Abstract
Room temperature stresses were found to be tensile for chemical vapor deposition films of the composition B2N and compressive for BN, with all films becoming more tensile with heating. Analyses of the stress‐temperature curves of identical films of BN deposited on two different substrate materials yield values of 1.3×1012 dynes/cm2 for the elastic stiffness parameter E/(1−ν) and 1.0 ppm/°C for the thermal expansion coefficient. This technique is of general applicability to thin films and it is believed to be the first practical (nondestructive) means of determining both the elastic stiffness parameter and thermal expansion coefficient of a film.Keywords
This publication has 6 references indexed in Scilit:
- Thermal stresses and cracking resistance of dielectric films (SiN, Si3N4, and SiO2) on Si substratesJournal of Applied Physics, 1978
- The temperature dependence of stresses in aluminum films on oxidized silicon substratesThin Solid Films, 1978
- High speed replication of submicron features on large areas by X-ray lithographyIEEE Transactions on Electron Devices, 1975
- Calculated elastic constants for stress problems associated with semiconductor devicesJournal of Applied Physics, 1973
- Thermal Expansion of Sputtered Silicon Nitride FilmsJournal of the Electrochemical Society, 1969
- Hot Pressed Boron NitrideIndustrial & Engineering Chemistry, 1955