Lead-Indium for Controlled-Collapse Chip Joining
- 1 September 1977
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Parts, Hybrids, and Packaging
- Vol. 13 (3), 194-198
- https://doi.org/10.1109/tphp.1977.1135198
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- Reliability of Controlled Collapse InterconnectionsIBM Journal of Research and Development, 1969
- Controlled Collapse Reflow Chip JoiningIBM Journal of Research and Development, 1969