Diffusion of silicon in gallium arsenide using rapid thermal processing: Experiment and model
- 15 April 1984
- journal article
- research article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 44 (8), 750-752
- https://doi.org/10.1063/1.94904
Abstract
Rapid thermal processing was used to diffuse Si into GaAs from a thin elemental source. Several encapsulants were applied. The diffusion was found to be dependent on the type of encapsulant. A model is developed based on the formation and rapid diffusion of Si nearest neighbor donor-acceptor pairs. Results from the codiffusion of Si and Ge support this model.Keywords
This publication has 2 references indexed in Scilit:
- Thermal pulse annealing of boron-implanted HgCdTeApplied Physics Letters, 1982
- Study of Encapsulants for Annealing Si‐Implanted GaAsJournal of the Electrochemical Society, 1982