Effect of Ti additions on the electrical resistivity of copper
- 1 April 1997
- journal article
- Published by Elsevier in Materials Science and Engineering: A
- Vol. 225 (1-2), 118-124
- https://doi.org/10.1016/s0921-5093(96)10578-5
Abstract
No abstract availableThis publication has 5 references indexed in Scilit:
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- Spinodal decomposition in age hardening copper-titanium alloysActa Metallurgica, 1975