Stresses in Adhesively Bonded Bi-Material Assemblies Used in Electronic Packaging
- 1 January 1986
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Structured Copper: A Pliable High Conductance Material for Bonding to Silicon Power DevicesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983
- Analysis of Bi-Metal ThermostatsJournal of the Optical Society of America, 1925