Deposition of Tantalum Films with an Open-Ended Vacuum System
- 1 January 1964
- journal article
- website
- Published by Institute of Electrical and Electronics Engineers (IEEE) in Bell System Technical Journal
- Vol. 43 (1), 127-142
- https://doi.org/10.1002/j.1538-7305.1964.tb04061.x
Abstract
New devices using vacuum-deposited metal films require a high-speed, low-cost method of vacuum deposition. The capability of the open-ended multiple-chamber deposition equipment has been investigated to determine its suitability for depositing tantal...Keywords
This publication has 1 reference indexed in Scilit:
- Properties of tantalum sputtered filmsMicroelectronics Reliability, 1962