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Number of Vias: A Control Parameter for Global Wiring of High-Density Chips
Home
Publications
Number of Vias: A Control Parameter for Global Wiring of High-Density Chips
Number of Vias: A Control Parameter for Global Wiring of High-Density Chips
DL
D. T. Lee
D. T. Lee
SH
S. J. Hong
S. J. Hong
CW
C.-K. Wong
C.-K. Wong
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1 July 1981
journal article
Published by
IBM
in
IBM Journal of Research and Development
Vol. 25
(4)
,
261-271
https://doi.org/10.1147/rd.254.0261
Abstract
No abstract available
Cited by 11 articles