Deformation behavior and microstructure evolution of pure Cu subjected to electromagnetic bulging
- 1 January 2014
- journal article
- Published by Elsevier in Materials Science and Engineering: A
- Vol. 593, 127-135
- https://doi.org/10.1016/j.msea.2013.11.032
Abstract
No abstract availableThis publication has 32 references indexed in Scilit:
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