Microstrip patch antenna miniaturisation techniques: a review

Abstract

The microstrip patch antenna (MPA) has been in use and has been studied extensively during the past three decades. This antenna, which consists of a metallic patch printed on a dielectric substrate over a ground plane, offers several advantages including ease of design and fabrication; low profile and planar structure; and ease of integration with circuit elements. The minimum dimension of a conventional MPA is in the order of half a wavelength. In recent years, with the advent of new standards and compact wireless devices, there has been a need to reduce the size of this type of antenna. This study discusses some of the principal techniques that have been reported in the literature to reduce the size of an MPA. These miniaturisation techniques include material loading, reshaping the antenna, shorting and folding, introducing slots and defects in the ground plane and the use of metamaterials. The major features and drawbacks of each of these approaches are highlighted in this study along with their effects on the antenna performance metrics.