Optimization of process parameters for laser soldering of surface mounted devices
- 1 January 1992
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 15 (6), 1155-1159
- https://doi.org/10.1109/33.206942
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- Dynamic characterization of surface-mount component leads for solder joint inspectionIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1989
- Laser Soldering of Surface Mounted AssembliesMicroelectronics International, 1987