Residual Stresses and Cracking in Metal/Ceramic Systems for Microelectronics Packaging
- 1 March 1985
- journal article
- Published by Wiley in Journal of the American Ceramic Society
- Vol. 68 (3), 120-127
- https://doi.org/10.1111/j.1151-2916.1985.tb09648.x
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
- Plastic flow localization due to non-uniform void distributionJournal of the Mechanics and Physics of Solids, 1984
- Microelectronic PackagingScientific American, 1983
- Flaw Characteristics in Dynamic Fatigue: The Influence of Residual Contact StressesJournal of the American Ceramic Society, 1980
- Structural ceramicsProgress in Materials Science, 1976
- Structural ceramicsProgress in Materials Science, 1976
- On the ductile enlargement of voids in triaxial stress fields∗Journal of the Mechanics and Physics of Solids, 1969
- A Criterion for Ductile Fracture by the Growth of HolesJournal of Applied Mechanics, 1968
- Plastic indentation in metals with conesJournal of the Mechanics and Physics of Solids, 1965