Investigation Of Photoablation As A Patterning Technique For Silicon Based Integrated Circuits: Laser Ablation And Physical Damage Threshold Considerations

Abstract

Damage threshold energies for a pulsed XeCl excimer laser at 308nm have been obtained for a number of microelectronic materials which may have patterning applications. A photoacoustic technique is used to identify the damage process. An example of laser patterning illustrating the constraints on laser energy is given.© (1990) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.