Low-cost technology for multilayer electroplated parts using laminated dry film resist
- 31 May 1996
- journal article
- Published by Elsevier in Sensors and Actuators A: Physical
- Vol. 53 (1-3), 364-368
- https://doi.org/10.1016/0924-4247(96)01171-5
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Galvanoplated 3D structures for micro systemsMicroelectronic Engineering, 1994
- Application of three-dimensional micro-optical components formed by lithography, electroforming, and plastic moldingApplied Optics, 1993
- Electrodeposition of 3D microstructures on siliconJournal of Micromechanics and Microengineering, 1993
- Metallic microdevices fabricated by deep-etch UV lithographyMaterials Science and Engineering: A, 1993
- Metal micromechanisms via deep X-ray lithography, electroplating and assemblyJournal of Micromechanics and Microengineering, 1992