The Application of an Eutectic Gold-Tin Cushion for TAB-Inner Lead Bonding with Reduced Bonding Pressure

Publisher Website

1 January 1990

book chapter
Published by Springer Nature

p. 400-406
https://doi.org/10.1007/978-3-642-45678-7_56

Abstract

No abstract available

Keywords

This publication has 2 references indexed in Scilit:

Laser Soldering of TAB Inner Lead Bonds
Published by Springer Nature ,1990
Investigations of failure mechanisms of TAB-bonded chips during thermal aging
IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1990

Cited by 6 articles