Abstract
The migration of defects, leading to eventual reaction, is analyzed on the basis of diffusion theory and compared with chemical rate theory. A diffusional treatment is carried out in detail and in special cases of particular interest. Correlations between interstitials and vacancies, typical of metals following electron irradiation, are examined. Trapping by impurities and dislocations, thermal conversion, and high temperature bombardment are also treated. In each case, formulations are developed along both one- and three-dimensional diffusion models. These alternative results are compared with experiments, particularly annealing in copper irradiated by electrons at low temperature. The results support the conclusion that the defect which migrates in Stage I diffuses in three dimensions.