A wafer with electrically programmable interconnections

1 January 1985

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

Vol. XXVIII, 268-269
https://doi.org/10.1109/isscc.1985.1156864

Abstract

Wafer-scale ring oscillators interconnected on a 100mm silicon substrate using discretionary electrical programming of two metalization levels with amorphous silicon alloy 'anti-fuses' will be reported.

Keywords

INTEGRATED CIRCUIT INTERCONNECTIONS
AMORPHOUS SILICON
FUSES
TRANSMISSION LINE MATRIX METHODS
SYSTEM TESTING
RING OSCILLATORS
ASSEMBLY SYSTEMS
POWER SYSTEM INTERCONNECTION
ACTIVE CIRCUITS
POWER DISTRIBUTION

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