Diffusion Bonding of Y-Ba-Cu-O High-Tc Superconductors

Abstract

Diffusion bonding of Y-Ba-Cu-O ceramics without insert materials was accomplished under the conditions in which bonding temperatures ranged from 1173 K to 1223 K and bonding times were longer than 4 h. It resulted in T _c and shear strength of the bonded joints which were almost identical to those of the bulk.