Temperature Dependence of Stress Relaxation at the Copper/Polyimide Interface
- 1 January 1986
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Reaction Kinetics, Stress And Microstructure In Titanium-Copper-Titanium Thin FilmsMRS Proceedings, 1985
- Calculation of stress in electrodeposits from the curvature of a plated stripJournal of Research of the National Bureau of Standards, 1949