Effects of Diffusion from Brass Substrates into Electrodeposited Tin Coatings on Corrosion Resistance and Whisker Growth

Abstract

Tin coatings electrodeposited direct on brass have an initial trace zinc content which makes them liable to tarnish in atmospheres containing sulphur dioxide. When more zinc reaches the surface by diffusion from the substrate, susceptibility to corrosive agents increases. Undercoats of copper or nickel are effective long-lasting barriers to zinc diffusion but permit the slower and less damaging growth of intermetallic compounds. Increased thickness of tin coating delays the arrival of diffusing metal at the surface and also reduces the effect on solderability of corrosion of a diffused coating. Diffusion is faster in tin coatings deposited bright. Tests to assess the extent of zinc diffusion and the liability of a coating to deteriorate in long storage with corrosion risk are discussed. Susceptibility of tin coatings to whisker growth has some parallel with their tendency to interdiffuse with the substrate.