Creep-fatigue interactions in solders
- 13 January 2003
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. chmt 8, 259-263
- https://doi.org/10.1109/ecc.1989.77759
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
- Isothermal fatigue of low tin lead based solderMetallurgical Transactions A, 1988
- A microstructural study of the thermal fatigue failures of 60sn-40Pb solder jointsJournal of Electronic Materials, 1988
- Creep-fatigue interaction in eutectic lead-tin solder alloyJournal of Materials Science, 1987
- Effect of frequency on the cyclic creep and fracture of a lead-rich lead-tin solder alloyScripta Metallurgica, 1987
- Functional Cycles and Surface Mounting Attachment ReliabilityCircuit World, 1985
- Deformation Modeling Applied to Stress Relaxation of Four Solder AlloysJournal of Engineering Materials and Technology, 1980