We describe and demonstrate what we believe is the first 3- axis MEMS active fiber optic micro-aligner, which will allow for in-package alignment of fiber optic and micro-optic components. The micro-aligner is a wafer level fabricated device, based on a combination of silicon micromachining and LIGA technology. The electrically controllable actuators demonstrate the high force and displacement necessary to overcome fiber optic, counterforce springs, friction, and wirebonds to perform in-package alignment of a fiber optic. We have demonstrated movement of > 20 microns in all three axes in an in-package configuration. The first prototype device are currently small enough (4 X 4 X 0.5 mm3) to fit into a standard 14 pin butterfly package. We will show that future devices with the same forces and displacements can be made smaller than 1 X 1 X 0.5 mm3 thus allowing for multiple single mode fiber optic attachments inside a standard opto-electronic package.