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Design and packaging approach for MMIC insertion in a broadband 4*4 microwave switch matrix
Home
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Design and packaging approach for MMIC insertion in a broadband 4*4 microwave switch matrix
Design and packaging approach for MMIC insertion in a broadband 4*4 microwave switch matrix
RG
R.K. Gupta
R.K. Gupta
HG
H.I. Gerson
H.I. Gerson
PR
P.B. Ross
P.B. Ross
FA
F.T. Assal
F.T. Assal
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6 January 2003
proceedings article
Published by
Institute of Electrical and Electronics Engineers (IEEE)
https://doi.org/10.1109/gaas.1988.11071
Abstract
No abstract available
Keywords
PACKAGING APPROACH
BROADBAND
SWITCH MATRIX
MICROWAVE SWITCH
MMIC INSERTION
Cited by 3 articles