Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints
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- 20 January 2003
- journal article
- Published by Elsevier in Journal of Alloys and Compounds
- Vol. 352 (1-2), 226-236
- https://doi.org/10.1016/s0925-8388(02)01166-0
Abstract
No abstract availableKeywords
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